Method and system for an integrated voltage controlled oscillator-based transmitter and on-chip power distribution network

ABSTRACT

Methods and systems for an integrated voltage controlled oscillator (VCO)-based transmitter and on-chip power distribution network are disclosed and may include supplying bias voltages and/or ground to a chip utilizing conductive lines. One or more VCOs and low-noise amplifiers (LNAs) may each be coupled to a leaky wave antenna (LWA) integrated in the bias voltage and/or ground lines. One or more clock signals may be generated utilizing the VCOs, which may be transmitted from the LWAs coupled to the VCOs, to the LWAs coupled to the LNAs. RF signals may be transmitted via the LWAs, and may include 60 GHz signals. The LWAs may include microstrip and/or coplanar waveguides, where a cavity length of the LWAs may be dependent on a spacing between conductive lines in the waveguides. The LWAs may be dynamically configured to transmit the clock signals at a desired angle from a surface of the chip.

CROSS-REFERENCE TO RELATED APPLICATIONS/INCORPORATION BY REFERENCE

This application also makes reference to:

-   U.S. patent application Ser. No. 12/650,212filed on Dec. 30, 2009;-   U.S. patent application Ser. No. 12/650,295filed on Dec. 30, 2009;-   U.S. patent application Ser. No. 12/650,277filed on Dec. 30, 2009;-   U.S. patent application Ser. No. 12/650,192filed on Dec. 30, 2009;-   U.S. patent application Ser. No. 12/650,224filed on Dec. 30, 2009;-   U.S. patent application Ser. No. 12/650,176filed on Dec. 30, 2009;-   U.S. patent application Ser. No. 12/650,246filed on Dec. 30, 2009;    and-   U.S. patent application Ser. No. 12/650,292filed on Dec. 30, 2009.

Each of the above stated applications is hereby incorporated herein byreference in its entirety.

FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

[Not Applicable]

MICROFICHE/COPYRIGHT REFERENCE

[Not Applicable]

FIELD OF THE INVENTION

Certain embodiments of the invention relate to wireless communication.More specifically, certain embodiments of the invention relate to amethod and system for an integrated voltage controlled oscillator-basedtransmitter and on-chip power distribution network.

BACKGROUND OF THE INVENTION

Mobile communications have changed the way people communicate and mobilephones have been transformed from a luxury item to an essential part ofevery day life. The use of mobile phones is today dictated by socialsituations, rather than hampered by location or technology. While voiceconnections fulfill the basic need to communicate, and mobile voiceconnections continue to filter even further into the fabric of every daylife, the mobile Internet is the next step in the mobile communicationrevolution. The mobile Internet is poised to become a common source ofeveryday information, and easy, versatile mobile access to this datawill be taken for granted.

As the number of electronic devices enabled for wireline and/or mobilecommunications continues to increase, significant efforts exist withregard to making such devices more power efficient. For example, a largepercentage of communications devices are mobile wireless devices andthus often operate on battery power. Additionally, transmit and/orreceive circuitry within such mobile wireless devices often account fora significant portion of the power consumed within these devices.Moreover, in some conventional communication systems, transmittersand/or receivers are often power inefficient in comparison to otherblocks of the portable communication devices. Accordingly, thesetransmitters and/or receivers have a significant impact on battery lifefor these mobile wireless devices.

Further limitations and disadvantages of conventional and traditionalapproaches will become apparent to one of skill in the art, throughcomparison of such systems with the present invention as set forth inthe remainder of the present application with reference to the drawings.

BRIEF SUMMARY OF THE INVENTION

A system and/or method for an integrated voltage controlledoscillator-based transmitter and on-chip power distribution network,substantially as shown in and/or described in connection with at leastone of the figures, as set forth more completely in the claims.

Various advantages, aspects and novel features of the present invention,as well as details of an illustrated embodiment thereof, will be morefully understood from the following description and drawings.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a block diagram of an exemplary wireless system with anintegrated voltage controlled oscillator-based transmitter and on-chippower distribution network, which may be utilized in accordance with anembodiment of the invention.

FIG. 2 is a block diagram illustrating an exemplary leaky wave antenna,in accordance with an embodiment of the invention.

FIG. 3 is a block diagram illustrating a plan view of exemplarypartially reflective surfaces, in accordance with an embodiment of theinvention.

FIG. 4 is a block diagram illustrating an exemplary phase dependence ofa leaky wave antenna, in accordance with an embodiment of the invention.

FIG. 5 is a block diagram illustrating exemplary in-phase andout-of-phase beam shapes for a leaky wave antenna, in accordance with anembodiment of the invention.

FIG. 6 is a block diagram illustrating a leaky wave antenna withvariable input impedance feed points, in accordance with an embodimentof the invention.

FIG. 7A is a block diagram of exemplary integrated voltage controlledoscillator-based transmitter and on-chip power distribution network, inaccordance with an embodiment of the invention.

FIG. 7B is a block diagram illustrating a cross-sectional view ofcoplanar and microstrip transmission lines, in accordance with anembodiment of the invention.

FIG. 8 is a block diagram illustrating exemplary steps for an integratedvoltage controlled oscillator-based transmitter and on-chip powerdistribution network, in accordance with an embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

Certain aspects of the invention may be found in a method and system foran integrated voltage controlled oscillator-based transmitter andon-chip power distribution network. Exemplary aspects of the inventionmay comprise supplying one or more bias voltages and/or ground to a chiputilizing the bias voltage and ground lines, respectively. One or morevoltage-controlled oscillators and one or more low-noise amplifiers maybe integrated on the chip and each of the one or more voltage-controlledoscillators and the one or more low-noise amplifiers may becommunicatively coupled to a leaky wave antenna integrated in the biasvoltage and/or ground lines to the chip. One or more clock signals maybe generated utilizing the one or more voltage-controlled oscillators.The generated clock signals may be transmitted by the leaky waveantennas communicatively coupled to the one or more voltage-controlledoscillators to the one or more leaky wave antennas communicativelycoupled to the one or more low-noise amplifiers.

Radio frequency (RF) signals may be transmitted via the one or moreleaky wave antennas, and may comprise 60 GHz signals. The leaky waveantennas comprise microstrip and/or coplanar waveguides, where a cavitylength of the leaky wave antennas may be dependent on a spacing betweenconductive lines in the microstrip and/or coplanar waveguides. The leakywave antennas may be configured to transmit the one or more generatedclock signals at a desired angle from a surface of the chip. The anglefrom the surface of the chip may be dynamically configured. A gain ofthe one or more low-noise amplifiers may be configured for receiving thetransmitted clock signals.

FIG. 1 is a block diagram of an exemplary wireless system with anintegrated voltage controlled oscillator-based transmitter and on-chippower distribution network, which may be utilized in accordance with anembodiment of the invention. Referring to FIG. 1, the wireless device150 may comprise an antenna 151, a transceiver 152, a baseband processor154, a processor 156, a system memory 158, a logic block 160, a chip162, leaky wave antennas 164A,164B, and 164C, a voltage-controlledoscillator (VCO) 165, an external headset port 166, and a package 167.The wireless device 150 may also comprise an analog microphone 168,integrated hands-free (IHF) stereo speakers 170, a printed circuit board171, a hearing aid compatible (HAC) coil 174, a dual digital microphone176, a vibration transducer 178, a keypad and/or touchscreen 180, and adisplay 182.

The transceiver 152 may comprise suitable logic, circuitry,interface(s), and/or code that may be enabled to modulate and upconvertbaseband signals to RF signals for transmission by one or more antennas,which may be represented generically by the antenna 151. The transceiver152 may also be enabled to downconvert and demodulate received RFsignals to baseband signals. The RF signals may be received by one ormore antennas, which may be represented generically by the antenna 151,or the leaky wave antennas 164A and 164B. Different wireless systems mayuse different antennas for transmission and reception. The transceiver152 may be enabled to execute other functions, for example, filteringthe baseband and/or RF signals, and/or amplifying the baseband and/or RFsignals. Although a single transceiver 152 is shown, the invention isnot so limited. Accordingly, the transceiver 152 may be implemented as aseparate transmitter and a separate receiver. In addition, there may bea plurality of transceivers, transmitters and/or receivers. In thisregard, the plurality of transceivers, transmitters and/or receivers mayenable the wireless device 150 to handle a plurality of wirelessprotocols and/or standards including cellular, WLAN and PAN. Wirelesstechnologies handled by the wireless device 150 may comprise GSM, CDMA,CDMA2000, WCDMA, GMS, GPRS, EDGE, WIMAX, WLAN, 3GPP, UMTS, BLUETOOTH,and ZigBee, for example.

The baseband processor 154 may comprise suitable logic, circuitry,interface(s), and/or code that may be enabled to process basebandsignals for transmission via the transceiver 152 and/or the basebandsignals received from the transceiver 152. The processor 156 may be anysuitable processor or controller such as a CPU, DSP, ARM, or any type ofintegrated circuit processor. The processor 156 may comprise suitablelogic, circuitry, and/or code that may be enabled to control theoperations of the transceiver 152 and/or the baseband processor 154. Forexample, the processor 156 may be utilized to update and/or modifyprogrammable parameters and/or values in a plurality of components,devices, and/or processing elements in the transceiver 152 and/or thebaseband processor 154. At least a portion of the programmableparameters may be stored in the system memory 158.

Control and/or data information, which may comprise the programmableparameters, may be transferred from other portions of the wirelessdevice 150, not shown in FIG. 1, to the processor 156. Similarly, theprocessor 156 may be enabled to transfer control and/or datainformation, which may include the programmable parameters, to otherportions of the wireless device 150, not shown in FIG. 1, which may bepart of the wireless device 150.

The processor 156 may utilize the received control and/or datainformation, which may comprise the programmable parameters, todetermine an operating mode of the transceiver 152. For example, theprocessor 156 may be utilized to select a specific frequency for a localoscillator, a specific gain for a variable gain amplifier, configure thelocal oscillator and/or configure the variable gain amplifier foroperation in accordance with various embodiments of the invention.Moreover, the specific frequency selected and/or parameters needed tocalculate the specific frequency, and/or the specific gain value and/orthe parameters, which may be utilized to calculate the specific gain,may be stored in the system memory 158 via the processor 156, forexample. The information stored in system memory 158 may be transferredto the transceiver 152 from the system memory 158 via the processor 156.

The system memory 158 may comprise suitable logic, circuitry,interface(s), and/or code that may be enabled to store a plurality ofcontrol and/or data information, including parameters needed tocalculate frequencies and/or gain, and/or the frequency value and/orgain value. The system memory 158 may store at least a portion of theprogrammable parameters that may be manipulated by the processor 156.

The logic block 160 may comprise suitable logic, circuitry,interface(s), and/or code that may enable controlling of variousfunctionalities of the wireless device 150. For example, the logic block160 may comprise one or more state machines that may generate signals tocontrol the transceiver 152 and/or the baseband processor 154. The logicblock 160 may also comprise registers that may hold data forcontrolling, for example, the transceiver 152 and/or the basebandprocessor 154. The logic block 160 may also generate and/or store statusinformation that may be read by, for example, the processor 156.Amplifier gains and/or filtering characteristics, for example, may becontrolled by the logic block 160.

The BT radio/processor 163 may comprise suitable circuitry, logic,interface(s), and/or code that may enable transmission and reception ofBluetooth signals. The BT radio/processor 163 may enable processingand/or handling of BT baseband signals. In this regard, the BTradio/processor 163 may process or handle BT signals received and/or BTsignals transmitted via a wireless communication medium. The BTradio/processor 163 may also provide control and/or feedback informationto/from the baseband processor 154 and/or the processor 156, based oninformation from the processed BT signals. The BT radio/processor 163may communicate information and/or data from the processed BT signals tothe processor 156 and/or to the system memory 158. Moreover, the BTradio/processor 163 may receive information from the processor 156and/or the system memory 158, which may be processed and transmitted viathe wireless communication medium a Bluetooth headset, for example

The CODEC 172 may comprise suitable circuitry, logic, interface(s),and/or code that may process audio signals received from and/orcommunicated to input/output devices. The input devices may be within orcommunicatively coupled to the wireless device 150, and may comprise theanalog microphone 168, the stereo speakers 170, the hearing aidcompatible (HAC) coil 174, the dual digital microphone 176, and thevibration transducer 178, for example. The CODEC 172 may be operable toup-convert and/or down-convert signal frequencies to desired frequenciesfor processing and/or transmission via an output device. The CODEC 172may enable utilizing a plurality of digital audio inputs, such as 16 or18-bit inputs, for example. The CODEC 172 may also enable utilizing aplurality of data sampling rate inputs. For example, the CODEC 172 mayaccept digital audio signals at sampling rates such as 8 kHz, 11.025kHz, 12 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, and/or 48 kHz.The CODEC 172 may also support mixing of a plurality of audio sources.For example, the CODEC 172 may support audio sources such as generalaudio, polyphonic ringer, I²S FM audio, vibration driving signals, andvoice. In this regard, the general audio and polyphonic ringer sourcesmay support the plurality of sampling rates that the audio CODEC 172 isenabled to accept, while the voice source may support a portion of theplurality of sampling rates, such as 8 kHz and 16 kHz, for example.

The chip 162 may comprise an integrated circuit with multiple functionalblocks integrated within, such as the transceiver 152, the processor156, the baseband processor 154, the BT radio/processor 163, the CODEC172, and the leaky wave antenna 164A. The number of functional blocksintegrated in the chip 162 is not limited to the number shown in FIG. 1.Accordingly, any number of blocks may be integrated on the chip 162depending on chip space and wireless device 150 requirements, forexample.

The VCO 165 may comprise suitable circuitry, logic, interfaces, and/orcode that may be operable to generate a clock signal for use by variouscircuitry in the chip 162.

The leaky wave antennas 164A, 164B, and 164C may comprise a resonantcavity with a highly reflective surface and a lower reflectivitysurface, and may be integrated in and/or on the chip 162, the package167, and/or the printed circuit board 171. The lower reflectivitysurface may allow the resonant mode to “leak” out of the cavity. Thelower reflectivity surface of the leaky wave antennas 164A, 164B, and164C may be configured with slots in a metal surface, or a pattern ofmetal patches, as described further in FIGS. 2 and 3. The physicaldimensions of the leaky wave antennas 164A, 164B, and 164C may beconfigured to optimize bandwidth of transmission and/or the beam patternradiated. In another embodiment of the invention, the leaky wave antenna164B may be integrated in and/or on the package 167, and the leaky waveantenna 164C may be integrated in and/or on the printed circuit board171 to which the chip 162 may be affixed. In this manner, the dimensionsof the leaky wave antennas 164B and 164C may not be limited by the sizeof the chip 162.

In an exemplary embodiment of the invention, the leaky wave antennas164A may comprise a plurality of leaky wave antennas integrated inand/or on the chip 162, and may be integrated into power traces inand/or on the chip 162. In this manner, the power traces may be utilizedto transmit a clock signal for the chip 162 as well as provide power tovarious regions of the chip 162. Accordingly, separate signal lines maynot be required to carry clock signals for various regions of the chip162.

The external headset port 166 may comprise a physical connection for anexternal headset to be communicatively coupled to the wireless device150. The analog microphone 168 may comprise suitable circuitry, logic,interface(s), and/or code that may detect sound waves and convert themto electrical signals via a piezoelectric effect, for example. Theelectrical signals generated by the analog microphone 168 may compriseanalog signals that may require analog to digital conversion beforeprocessing.

The package 167 may comprise a ceramic package, a printed circuit board,or other support structure for the chip 162 and other components of thewireless device 150. In this regard, the chip 162 may be bonded to thepackage 167. The package 167 may comprise insulating and conductivematerial, for example, and may provide isolation between electricalcomponents mounted on the package 167.

The stereo speakers 170 may comprise a pair of speakers that may beoperable to generate audio signals from electrical signals received fromthe CODEC 172. The HAG coil 174 may comprise suitable circuitry, logic,and/or code that may enable communication between the wireless device150 and a T-coil in a hearing aid, for example. In this manner,electrical audio signals may be communicated to a user that utilizes ahearing aid, without the need for generating sound signals via aspeaker, such as the stereo speakers 170, and converting the generatedsound signals back to electrical signals in a hearing aid, andsubsequently back into amplified sound signals in the user's ear, forexample.

The dual digital microphone 176 may comprise suitable circuitry, logic,interface(s), and/or code that may be operable to detect sound waves andconvert them to electrical signals. The electrical signals generated bythe dual digital microphone 176 may comprise digital signals, and thusmay not require analog to digital conversion prior to digital processingin the CODEC 172. The dual digital microphone 176 may enable beamformingcapabilities, for example.

The vibration transducer 178 may comprise suitable circuitry, logic,interface(s), and/or code that may enable notification of an incomingcall, alerts and/or message to the wireless device 150 without the useof sound. The vibration transducer may generate vibrations that may bein synch with, for example, audio signals such as speech or music.

In operation, control and/or data information, which may comprise theprogrammable parameters, may be transferred from other portions of thewireless device 150, not shown in FIG. 1, to the processor 156.Similarly, the processor 156 may be enabled to transfer control and/ordata information, which may include the programmable parameters, toother portions of the wireless device 150, not shown in FIG. 1, whichmay be part of the wireless device 150.

The processor 156 may utilize the received control and/or datainformation, which may comprise the programmable parameters, todetermine an operating mode of the transceiver 152. For example, theprocessor 156 may be utilized to select a specific frequency for a localoscillator, a specific gain for a variable gain amplifier, configure thelocal oscillator and/or configure the variable gain amplifier foroperation in accordance with various embodiments of the invention.Moreover, the specific frequency selected and/or parameters needed tocalculate the specific frequency, and/or the specific gain value and/orthe parameters, which may be utilized to calculate the specific gain,may be stored in the system memory 158 via the processor 156, forexample. The information stored in system memory 158 may be transferredto the transceiver 152 from the system memory 158 via the processor 156.

The CODEC 172 in the wireless device 150 may communicate with theprocessor 156 in order to transfer audio data and control signals.Control registers for the CODEC 172 may reside within the processor 156.The processor 156 may exchange audio signals and control information viathe system memory 158. The CODEC 172 may up-convert and/or down-convertthe frequencies of multiple audio sources for processing at a desiredsampling rate.

The leaky wave antennas 164A may be integrated in power traces in and/oron the chip 162, thereby providing transmission and receiving capabilitywith conductive traces that also supply power to the chip 162. In anexemplary embodiment of the invention, one leaky wave antenna of theleaky wave antennas 164A may transmit a clock signal generated by theVCO 165, and the other leaky wave antennas of the leaky wave antennas164A may be operable to receive the transmitted signal. Low-noiseamplifiers in the transceiver 152 may amplify the signals received fromthe leaky wave antennas, thereby generating a plurality of clock signalslocally from a centrally generated clock signal without the need forseparate clock traces throughout the chip 162.

FIG. 2 is a block diagram illustrating an exemplary leaky wave antenna,in accordance with an embodiment of the invention. Referring to FIG. 2,there is shown the leaky wave antennas 164A, 164B, and/or 164Ccomprising a partially reflective surface 201A, a reflective surface201B, and a feed point 203. The space between the partially reflectivesurface 201A and the reflective surface 201B may be filled withdielectric material, for example, and the height, h, between thepartially reflective surface 201A and the reflective surface 201B may beutilized to configure the frequency of transmission of the leaky waveantenna 164A, 164B, and/or 164C.

The feed point 203 may comprise a input terminal for applying an inputvoltage to the leaky wave antenna 164A, 164B, and/or 164C. The inventionis not limited to a single feed point 203, as there may be any amount offeed points for different phases of signal, for example, to be appliedto the leaky wave antenna 164A, 164B, and/or 164C.

In an embodiment of the invention, the height, h, may be one-half thewavelength of the desired transmitted mode from the leaky wave antenna164A, 164B, and/or 164C. In this manner, the phase of an electromagneticmode that traverses the cavity twice may be coherent with the inputsignal at the feed point 203, thereby configuring a resonant cavityknown as a Fabry-Perot cavity. The magnitude of the resonant mode maydecay exponentially in the lateral direction from the feed point 203,thereby reducing or eliminating the need for confinement structures tothe sides of the leaky wave antenna 164A, 164B, and/or 164C. The inputimpedance of the leaky wave antenna 164A, 164B, and/or 164C may beconfigured by the vertical placement of the feed point 203, as describedfurther in FIG. 6.

In operation, a signal to be transmitted via a power amplifier may becommunicated to the feed point 203 of the leaky wave antennas 164A,164B, and/or 164C with a frequency f. The cavity height, h, may beconfigured to correlate to one half the wavelength of a harmonic of thesignal of frequency f. The signal may traverse the height of the cavityand may be reflected by the partially reflective surface 201A, and thentraverse the height back to the reflective surface 201B. Since the wavewill have travelled a distance corresponding to a full wavelength,constructive interference may result and a resonant mode may thereby beestablished.

Leaky wave antennas may enable the configuration of high gain antennaswithout the need for a large array of antennas which require a complexfeed network and suffer from loss due to feed lines. The leaky waveantennas 164A may be integrated in power traces in and/or on the chip162, thereby providing transmission and receiving capability withconductive traces that also supply power to the chip 162. In anexemplary embodiment of the invention, one leaky wave antenna of theleaky wave antennas 164A may transmit a clock signal generated by theVCO 165, and the other leaky wave antennas of the leaky wave antennas164A may be operable to receive the transmitted signal. Low-noiseamplifiers in the transceiver 152 may amplify the signals received fromthe leaky wave antennas, thereby generating a plurality of clock signalslocally from a centrally generated clock signal without the need forseparate clock traces throughout the chip 162.

FIG. 3 is a block diagram illustrating a plan view of exemplarypartially reflective surfaces, in accordance with an embodiment of theinvention. Referring to FIG. 3, there is shown a partially reflectivesurface 300 comprising periodic slots in a metal surface, and apartially reflective surface 320 comprising periodic metal patches. Thepartially reflective surfaces 300/320 may comprise different embodimentsof the partially reflective surface 201A described with respect to FIG.2.

The spacing, dimensions, shape, and orientation of the slots and/orpatches in the partially reflective surfaces 300/320 may be utilized toconfigure the bandwidth, and thus Q-factor, of the resonant cavitydefined by the partially reflective surfaces 300/320 and a reflectivesurface, such as the reflective surface 201B, described with respect toFIG. 2. The partially reflective surfaces 300/320 may thus comprisefrequency selective surfaces due to the narrow bandwidth of signals thatmay leak out of the structure as configured by the slots and/or patches.

The spacing between the patches and/or slots may be related towavelength of the signal transmitted and/or received, which may besomewhat similar to beamforming with multiple antennas. The length ofthe slots and/or patches may be several times larger than the wavelengthof the transmitted and/or received signal or less, for example, sincethe leakage from the slots and/or regions surround the patches may addup, similar to beamforming with multiple antennas.

In an embodiment of the invention, the slots/patches may be configuredvia micro-electromechanical system (MEMS) switches to tune the Q of theresonant cavity.

FIG. 4 is a block diagram illustrating an exemplary phase dependence ofa leaky wave antenna, in accordance with an embodiment of the invention.Referring to FIG. 4, there is shown a leaky wave antenna comprising thepartially reflective surface 201A, the reflective surface 201B, and thefeed point 203. In-phase condition 400 illustrates the relative beamshape transmitted by the leaky wave antenna 164A, 164B, and/or 164C whenthe frequency of the signal communicated to the feed point 203 matchesthat of the resonant cavity as defined by the cavity height, h, and thedielectric constant of the material between the reflective surfaces.

Similarly, out-of-phase condition 420 illustrates the relative beamshape transmitted by the leaky wave antenna 164A, 164B, and/or 164C whenthe frequency of the signal communicated to the feed point 203 does notmatch that of the resonant cavity. The resulting beam shape may beconical, as opposed to a single main vertical node. These areillustrated further with respect to FIG. 5. The leaky wave antennas 164Amay be integrated in power traces in and/or on the chip 162, therebyproviding a plurality of transmission and reception sites on the chip162 as well as providing power and ground lines. By configuring theleaky wave antennas for in-phase and out-of-phase conditions, signalsmay be directed out of the chip 162 in desired directions. In anexemplary embodiment of the invention, the angle at which signals may betransmitted by a leaky wave antenna may be dynamically controlled sothat signal may be directed to desired receiving leaky wave antennas.

FIG. 5 is a block diagram illustrating exemplary in-phase andout-of-phase beam shapes for a leaky wave antenna, in accordance with anembodiment of the invention. Referring to FIG. 5, there is shown a plot500 of transmitted signal beam shape versus angle, Θ, for the in-phaseand out-of-phase conditions for a leaky wave antenna.

The In-phase curve in the plot 500 may correlate to the case where thefrequency of the signal communicated to a leaky wave antenna matches theresonant frequency of the cavity. In this manner, a single vertical mainnode may result. In instances where the frequency of the signal at thefeed point is not at the resonant frequency, a double, or conical-shapednode may be generated as shown by the Out-of-phase curve in the plot500. By configuring the leaky wave antennas for in-phase andout-of-phase conditions, signals may be directed out of the chip 162 indesired directions.

FIG. 6 is a block diagram illustrating a leaky wave antenna withvariable input impedance feed points, in accordance with an embodimentof the invention. Referring to FIG. 6, there is shown a leaky waveantenna 600 comprising the partially reflective surface 201A and thereflective surface 201B. There is also shown feed points 601A-601C. Thefeed points 601A-601C may be located at different positions along theheight, h, of the cavity thereby configuring different impedance pointsfor the leaky wave antenna.

In this manner, a leaky wave antenna may be utilized to couple to aplurality of power amplifiers or low-noise amplifiers with varyingoutput impedances. Similarly, by integrating leaky wave antennas inpower and ground traces, the impedance of the leaky wave antenna may bematched to the power amplifier or low-noise amplifier communicating asignal to be transmitted or a signal that was received.

FIG. 7A is a block diagram of exemplary integrated voltage controlledoscillator-based transmitter and on-chip power distribution network, inaccordance with an embodiment of the invention. Referring to FIG. 7A,there is shown integrated voltage controlled oscillator-basedtransmitter and on-chip power distribution network 700 comprising aV_(DD) line 701A, a ground line 701B, leaky wave antennas 703A-703D, theVCO 165, and low-noise amplifiers (LNAs) 705A-705C.

The V_(DD) line 701A and the ground line 701B may comprise metal, orother conductive material, traces integrated in and/or on a chip, suchas the chip 162. The V_(DD) line 701A and the ground line 701B mayprovide power to the chip 162 and may also be utilized to transmitand/or receive RF signals by integrating leaky wave antennas in theconductive traces.

The leaky wave antennas 703A-703D may be substantially similar to theleaky wave antennas 164A, 164B, and 164C, and may be integrated inand/or on the V_(DD) line 701A and the ground line 701B. In an exemplaryembodiment of the invention, the leaky wave antenna 703A may be operableto receive input signals to be transmitted from the VCO 165. The leakywave antennas 703A, 703C, and/or 703D may be operable to receive signalsthat may be transmitted from the leaky wave antenna 703B.

The LNAs 705A-705C may comprise suitable circuitry, logic, interfaces,and/or code that may be operable to amplify signals received from theleaky wave antennas 703A, 703C, and 703D, respectively. The LNAs705A-705C may therefore be operable to generate clock signals, CLK,which may be utilized by various circuitry in the chip 162.

In operation, the VCO 165 may generate a clock signal that may betransmitted by the leaky wave antenna 703B. The leaky wave antennas703A, 703C, and/or 703D may receive the signal transmitted by the leakywave antenna 703B. The LNAs 705A-705C may amplify the received signals,thereby generating distributed clock signals on the chip 162 from asingle clock source, the VCO 165. By integrating the leaky wave antennas703A-703D into the V_(DD) line 701A and the ground line 701B, power maybe supplied to the chip 162 and signals may be transmitted from oneregion of the chip 162 to a plurality of locations, thereby distributingclock signals across the chip 162 without the need for lengthy clocktraces that may degrade high speed clock signals.

The leaky wave antennas 703A-703D may comprise microstrip and/orcoplanar waveguides formed by the V_(DD) line 701A and the ground line701B. The leaky wave antennas 703A-703D may be distributed in aplurality of locations along the V_(DD) line 701A and the ground line701B.

The invention is not limited to a single bias voltage and ground line.Accordingly, any number of bias voltage lines may be incorporated,depending on desired voltage levels and chip space requirements, forexample. Thus, leaky wave antennas may be integrated into two biasvoltage lines or between signal lines and a ground line.

FIG. 7B is a block diagram illustrating a cross-sectional view ofcoplanar and microstrip transmission lines, in accordance with anembodiment of the invention. Referring to FIG. 7B, there is shown amicrostrip transmission line 720 and a coplanar transmission line 730,either of which may be used in the V_(DD) line 701A and/or the groundline 701B described with respect to FIG. 7A. The microstrip transmissionline 720 may comprise signal conductive lines 723, a ground plane 725,an insulating layer 727 and a substrate 729. The coplanar transmissionline 730 may comprise signal conductive lines 731 and 733, theinsulating layer 727, and the substrate 729.

The signal conductive lines 723, 731, and 733 may comprise metal tracesdeposited in and/or on the insulating layer 727. In another embodimentof the invention, the signal conductive lines 723, 731, and 733 maycomprise poly-silicon or other conductive material. The separation andthe voltage potential between the signal conductive line 723 and theground plane 725 may determine the electric field generated therein. Inaddition, the dielectric constant of the insulating layer 727 may alsodetermine the electric field between the signal conductive line 723 andthe ground plane 725.

The insulating layer 727 may comprise SiO₂ or other insulating materialthat may provide a high resistance layer between the signal conductiveline 723 and the ground plane 725. In addition, the electric fieldbetween the signal conductive line 723 and the ground plane 725 isdependent on the dielectric constant of the insulating layer 727.

The coplanar transmission line 730 may comprise the signal conductivelines 731 and 733 and the insulating layer 727. The thickness and thedielectric constant of the insulating layer 727 may determine theelectric field strength generated by the propagating signal. Theresonant cavity thickness of a leaky wave antenna may be dependent onthe spacing between the signal conductive line 723 and the ground plane725, or the signal conductive lines 731 and 733.

The substrate 729 may comprise a semiconductor or insulator materialthat may provide mechanical support for the microstrip transmission line720, the coplanar transmission line 730, and other devices that may beintegrated within. In another embodiment of the invention, the substrate729 may comprise Si, GaAs, sapphire, InP, GaO, ZnO, CdTe, CdZnTe and/orAl₂O₃, for example, or any other substrate material that may be suitablefor integrating microstrip structures.

In operation, a bias voltage may be applied across the signal conductiveline 723 and the ground plane 725, and/or the signal conductive lines731 and 733. The thickness of a leaky wave antenna resonant cavity maybe dependent on the distance between the microstrip transmission line720 and/or the coplanar transmission line 730.

In addition to DC bias and ground, a signal to be transmitted orreceived, such as a 60 GHz RF signal, may be communicated to or from thesignal conductive lines 723, 731, and 733, and the ground plane 725. Inthis manner, the power line traces on the chip 162 may transmit and/orreceive signals as well as supply DC bias. In this manner, a clocksignal may be transmitted by a leaky wave antenna, with the signal beingreceived by one or more leaky wave antennas on the same chip, therebyproviding clock distribution without the need for long conductive clocktraces.

FIG. 8 is a block diagram illustrating exemplary steps for an integratedvoltage controlled oscillator-based transmitter and on-chip powerdistribution network, in accordance with an embodiment of the invention.Referring to FIG. 8, in step 803 after start step 801, bias voltage andground may be applied to supply and/or ground lines, respectively, andthe VCO may be configured for a desired frequency clock signal. In step805, the VCO clock signal may be communicated to and transmitted by aleaky wave antenna to one or more receiving leaky wave antennas. In step807, the leaky wave antennas may receive the transmitted clock signaland communicate it to LNAs for amplification, thereby generatingdistributed clock signals. In step 809, in instances where the wirelessdevice 150 is to be powered down, the exemplary steps may proceed to endstep 811. In instances when the wireless device 150 is not to be powereddown, the exemplary steps may proceed to step 803 to configure the VCOat a desired frequency.

In an embodiment of the invention, a method and system are disclosed forsupplying one or more bias voltages and/or ground to a chip 162utilizing bias voltage 701A and/or ground lines 701B, respectively. Oneor more voltage-controlled oscillators 165 and one or more low-noiseamplifiers 705A-705C may be integrated on the chip 162 and each of theone or more voltage-controlled oscillators 165 and the one or morelow-noise amplifiers 705A-705C may be communicatively coupled to a leakywave antenna 164A, 600, and/or 703A-703D integrated in the bias voltage701A and/or ground 701B lines to the chip 162. One or more clock signalsmay be generated utilizing the one or more voltage-controlledoscillators 165. The generated clock signals may be transmitted by theleaky wave antennas 164A, 600, and/or 703B communicatively coupled tothe one or more voltage-controlled oscillators 165 to the one or moreleaky wave antennas 164A, 600, and/or 703A, 703C, and/or 703Dcommunicatively coupled to the one or more low-noise amplifiers705A-705C. Radio frequency (RF) signals may be transmitted via the oneor more leaky wave antennas 164A, 600, and/or 703B, and may comprise 60GHz signals. The leaky wave antennas 164A, 600, and/or 703A-703D maycomprise microstrip 720 and/or coplanar 730 waveguides, where a cavitylength of the leaky wave antennas 164A, 600, and/or 703A-703D may bedependent on a spacing between conductive lines 723 and 725 and/or 731and 733 in the microstrip 720 and/or coplanar 730 waveguides. The leakywave antennas 164A, 600, and/or 703A-703D may be configured to transmitthe one or more generated clock signals at a desired angle, Θ, from asurface of the chip 162. The desired angle, Θ, from the surface of thechip 162 may be dynamically configured. A gain of the one or morelow-noise amplifiers 705A-705C may be configured for receiving thetransmitted clock signals.

Another embodiment of the invention may provide a machine and/orcomputer readable storage and/or medium, having stored thereon, amachine code and/or a computer program having at least one code sectionexecutable by a machine and/or a computer, thereby causing the machineand/or computer to perform the steps as described herein for anintegrated voltage controlled oscillator-based transmitter and on-chippower distribution network.

Accordingly, aspects of the invention may be realized in hardware,software, firmware or a combination thereof. The invention may berealized in a centralized fashion in at least one computer system or ina distributed fashion where different elements are spread across severalinterconnected computer systems. Any kind of computer system or otherapparatus adapted for carrying out the methods described herein issuited. A typical combination of hardware, software and firmware may bea general-purpose computer system with a computer program that, whenbeing loaded and executed, controls the computer system such that itcarries out the methods described herein.

One embodiment of the present invention may be implemented as a boardlevel product, as a single chip, application specific integrated circuit(ASIC), or with varying levels integrated on a single chip with otherportions of the system as separate components. The degree of integrationof the system will primarily be determined by speed and costconsiderations. Because of the sophisticated nature of modernprocessors, it is possible to utilize a commercially availableprocessor, which may be implemented external to an ASIC implementationof the present system. Alternatively, if the processor is available asan ASIC core or logic block, then the commercially available processormay be implemented as part of an ASIC device with various functionsimplemented as firmware.

The present invention may also be embedded in a computer programproduct, which comprises all the features enabling the implementation ofthe methods described herein, and which when loaded in a computer systemis able to carry out these methods. Computer program in the presentcontext may mean, for example, any expression, in any language, code ornotation, of a set of instructions intended to cause a system having aninformation processing capability to perform a particular functioneither directly or after either or both of the following: a) conversionto another language, code or notation; b) reproduction in a differentmaterial form. However, other meanings of computer program within theunderstanding of those skilled in the art are also contemplated by thepresent invention.

While the invention has been described with reference to certainembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted withoutdeparting from the scope of the present invention. In addition, manymodifications may be made to adapt a particular situation or material tothe teachings of the present invention without departing from its scope.Therefore, it is intended that the present invention not be limited tothe particular embodiments disclosed, but that the present inventionwill include all embodiments falling within the scope of the appendedclaims.

What is claimed is:
 1. A method for communication, the methodcomprising: performing using one or more or more circuits in a wirelessdevice, said one or more circuits comprising one or morevoltage-controlled oscillators and one or more low-noise amplifiers on achip, wherein each of said one or more voltage-controlled oscillatorsand said one or more low-noise amplifiers is communicatively coupled toa leaky wave antenna integrated in bias voltage and/or ground lines tosaid chip: supplying one or more bias voltages and/or ground for saidchip utilizing said bias voltage and/or ground lines, respectively;generating one or more clock signals utilizing said one or morevoltage-controlled oscillators; and transmitting said generated clocksignals via said leaky wave antennas communicatively coupled to said oneor more voltage-controlled oscillators to said one or more leaky waveantennas communicatively coupled to said one or more low-noiseamplifiers.
 2. The method according to claim 1, comprising transmittingradio frequency (RF) signals via said one or more leaky wave antennas.3. The method according to claim 2, wherein said RF signals comprise 60GHz signals.
 4. The method according to claim 1, wherein said leaky waveantennas comprise microstrip waveguides.
 5. The method according toclaim 4, wherein a cavity length of said leaky wave antennas isdependent on a spacing between conductive lines in said microstripwaveguides.
 6. The method according to claim 1, wherein said leaky waveantennas comprise coplanar waveguides.
 7. The method according to claim6, wherein a cavity length of said leaky wave antennas is dependent on aspacing between conductive lines in said coplanar waveguides.
 8. Themethod according to claim 1, comprising configuring said leaky waveantennas to transmit said one or more generated clock signals at adesired angle from a surface of said chip.
 9. The method according toclaim 8, comprising dynamically configuring said angle from said surfaceof said chip.
 10. The method according to claim 1, comprisingconfiguring a gain of said one or more low-noise amplifiers forreceiving said transmitted clock signals.
 11. A system for enablingcommunication, the system comprising: one or more or more circuits in awireless device, said one or more circuits comprising one or morevoltage-controlled oscillators and one or more low-noise amplifiers on achip, wherein each said one or more voltage-controlled oscillators andsaid one or more low-noise amplifiers is communicatively coupled to aleaky wave antenna integrated in bias voltage and/or ground lines tosaid chip, said one or more circuits being operable to: supply one ormore bias voltages and ground for said chip utilizing said bias voltageand/or ground lines, respectively; generate one or more clock signalsutilizing said one or more voltage-controlled oscillators; and transmitsaid generated clock signals via said leaky wave antennascommunicatively coupled to said one or more voltage-controlledoscillators to said one or more leaky wave antennas communicativelycoupled to said one or more low-noise amplifiers.
 12. The systemaccording to claim 11, wherein said one or more circuits are operable totransmit radio frequency (RF) signals via said one or more leaky waveantennas.
 13. The system according to claim 12, wherein said one or morecircuits are operable to wherein said RF signals comprise 60 GHzsignals.
 14. The system according to claim 11, wherein said leaky waveantennas comprise microstrip waveguides.
 15. The system according toclaim 14, wherein a cavity length of said leaky wave antennas isdependent on a spacing between conductive lines in said microstripwaveguides.
 16. The system according to claim 11, wherein said leakywave antennas comprise coplanar waveguides.
 17. The system according toclaim 16, wherein a cavity length of said leaky wave antennas isdependent on a spacing between conductive lines in said coplanarwaveguides.
 18. The system according to claim 11, wherein said one ormore circuits are operable to configure said leaky wave antennas totransmit said one or more generated clock signals at a desired anglefrom a surface of said chip.
 19. The system according to claim 18,wherein said one or more circuits are operable to dynamically configuresaid angle from said surface of said chip.
 20. The system according toclaim 11, wherein a gain of said one or more low-noise amplifiers isconfigured for receiving said transmitted clock signals.